Material
Surface Layer: Gold, gold alloy, pure silver, silver-nickel, silver-copper, silver cadmium oxide, silver tin oxide, etc.
Base Material: Pure silver, silver alloy, copper, brass, phosphor bronze, beryllium copper, nickel silver, nickel, iron, stainless steel, Monel, etc.
Specification
Surface Layer Thickness: 0.02–1.0 mm
Base Material Thickness: 0.05–3.5 mm
Application
Primarily used in conductive components such as wall switches, protectors, thermostats, micro-motor brushes, and micro-switches.
Advantage
The key feature of the clad strip lies in its ability to organically combine the unique electrical and chemical properties of precious metals (gold, silver, platinum, palladium, iridium, rhodium, ruthenium, osmium) with the excellent mechanical properties of materials such as copper alloys. This results in superior comprehensive performance—offering stronger bonding than electroplating, with no delamination and secure adhesion—while significantly conserving precious metals.
Product capacity
The clad strip, formed by bonding dissimilar materials, overcomes the limitations of individual components and leverages the respective strengths of each constituent. This yields excellent overall properties, including high bonding strength, good electrical and thermal conductivity, corrosion resistance, vibration damping, wear resistance, as well as specific specialized functionalities tailored to the clad strip. The manufacturing process is simplified by eliminating traditional riveting or welding steps. It also features low temperature rise, superior performance, and enables integrated structural design.
Capacity
30 tons per month.
